Shenzhen International Semiconductor Exhibition and Integrated Circuit Industry Innovation Exhibition

【Exhibition Overview】

    Shenzhen International Semiconductor Exhibition and Integrated Circuit Industry Innovation Exhibition (SEMI-e), in order to further strengthen domestic and international exchanges and cooperation in the industry, showcase the latest technological achievements in the field, and promote the healthy and sustainable development of the integrated circuit industry, is co-organised by China International Optoelectronic Exposition (referred to as CIOE) and the Integrated Circuit Innovation Alliance.

    As a highly influential and professional semiconductor exhibition in the industry, SEMI-e is deeply rooted in the forefront of industry development, spanning all upstream and downstream segments of the industry chain, bringing together over 1,000 quality exhibitors, with a total exhibition area of 60,000 square metres.

    The scope of exhibits at this exhibition is very extensive, covering multiple segmented fields such as chips and chip design, semiconductor equipment, semiconductor materials, advanced packaging, core semiconductor components, wide bandgap semiconductors, power devices, and AI computing power. It is not only an efficient platform for one-stop procurement of various materials, devices, equipment, and solutions required for R&D and production, but also a professional business platform for completing precise commercial demand matching, rapidly expanding business networks, and staying updated on the latest industry information and trends.

    The exhibition fully covers the entire industry chain ecosystem from terminals, design, manufacturing, packaging and testing, equipment, materials, EDA/IP, to components. This edition will be held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall), located at No. 1 Zhancheng Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen.

【Exhibition Value】

    This exhibition is organised by CIOE and the Integrated Circuit Innovation Alliance, and undertaken by Aijiwei and Shenzhen Zhongxincai Exhibition Co., Ltd. After several editions of development, it has grown into a highly influential professional exhibition platform in the industry. This edition will be held jointly at the same time and venue with CIOE, the global benchmark of the optoelectronic industry, for the first time. The total scale of the two exhibitions will exceed 300,000 square metres, bringing together over 5,000 quality exhibitors, jointly building a super exhibition platform covering the two core fields of integrated circuits and optoelectronics.

    This optoelectronics-plus-semiconductor industry synergy ecosystem provides exhibiting companies with a strategic channel to break through industry boundaries and achieve cross-industry integration and innovation, helping companies connect with more cross-domain resources. The exhibition focuses on three core themes: IC chips and design, wafer manufacturing and packaging and testing, and compound semiconductors, fully covering the entire industry chain ecosystem including chip design, wafer manufacturing, advanced packaging, power devices, semiconductor equipment and components, and materials. In 2025, the exhibition brought together 1,062 quality exhibitors, showcasing cutting-edge achievements such as edge-side AI chips, third-generation semiconductors, co-packaged optics (CPO), and TGV technology, presenting a complete picture of the latest technological breakthroughs and innovation vitality of the integrated circuit industry.

    The exhibition helps exhibitors precisely connect with a large number of quality buyer resources, deeply empowering industry business cooperation. In 2025, the exhibition attracted a total of 43,986 professional visitors, with total visits exceeding 75,658. Professional visitors from semiconductor manufacturing and services and core product areas accounted for 60.48%, covering core segments such as wafer manufacturing, packaging and testing, chip design, and equipment and materials. Leading enterprises including SMIC, Hua Hong Semiconductor, CanSemi, BYD Auto, and ams-OSRAM attended as VIP invited buyers, providing an efficient channel for exhibitors to precisely connect with procurement decision-makers.

【Exhibition Zones】

    The exhibition features multiple professional display zones based on segmented areas of the entire industry chain, namely:

    - IC Manufacturing and Supply Chain Zone, covering front-end manufacturing, packaging and testing, equipment, materials, and components

    - IC Design and Application Zone, covering automotive electronic chips, smart wearable chips, industrial control chips, communication chips, security chips, computing chips, sensor chips, as well as EDA/IP

    - Compound Semiconductor Zone, covering power devices, compound semiconductor materials, and compound semiconductor equipment

【Core Exhibiting Companies】

    A large number of core semiconductor industry enterprises have already confirmed their participation, covering all segments of the entire industry chain. Key exhibiting companies include:

    - Chips and Chip Design: UNISOC, ZTE Microelectronics, Zhaoxin, Beijing Ingenic, Suzhou Guoxin, Empyrean, VeriSilicon, Fudan Microelectronics, GigaDevice, Goodix, Cambricon, Horizon Robotics, etc.

    - Wafer Manufacturing and Packaging and Testing: Hua Hong Semiconductor, XMC, Tongfu Microelectronics, Huajin Semiconductor, JCET, Hua Tian Technology, Zengxin Technology, Tianxin Interconnect, China Resources Microelectronics, CanSemi, etc.

    - Power and Compound Semiconductors: BYD Semiconductor, WeEn Semiconductors, TankeBlue, SICC, Puxing Electronics, Nanshan Crystals, Navitas Semiconductor, Innoscience, Basic Semiconductor, Yangjie Technology, etc.

    - Semiconductor Equipment: NAURA, AMEC, ACM Research, Hwatsing Technology, Piotech, Kingsemi, Skyverse, JEOL, Crystalsource, Changchuan Technology, Huazhuo Precision, Yuwu Semiconductor, etc.

    - Semiconductor Materials and Components: NSIG, Jiangfeng Electronics, Anji Microelectronics, Shanghai Sinyang, China Shipbuilding Special Gas, Nanda Optoelectronic, Fuchuang Precision, Siasun Semiconductor, Hiwin Technologies, Xinlai Group, etc.

    - Research Institutes and Industry Alliances: Jihua Laboratory, Demonstration Microelectronics College Industry-Academia Integration Development Alliance, Integrated Circuit Materials Innovation Consortium, China Automotive Chip Industry Innovation Strategic Alliance, National Third-Generation Semiconductor Technology Innovation Center (Shenzhen), etc.

【Concurrent Events】

    During the exhibition, 22 professional conferences and events will be held concurrently, with 130 industry guests invited to deliver speeches. Topics cover multiple popular industry directions such as edge-side AI chips, RISC-V ecosystem, power semiconductors, advanced packaging, co-packaged optics (CPO), and TGV technology. Corporate representatives and academic experts from institutions including Empyrean, Intellifusion, Suzhou Guoxin, FAW Hongqi, Tsinghua University, and Southern University of Science and Technology will gather together, providing key references for corporate strategic planning through a combination of data forecasting, trend interpretation, and technology discussion.