WESEMIBAY SEMICONDUCTOR ECOSYSTEM EXPO

【Exhibition Overview】

    Shenzhen Bay Semiconductor Ecosystem Expo, abbreviated as WESEMIBAY, is the core exhibition platform under Shenzhen's "Six Ones" working mechanism. Since its inception in 2024, it has developed into a professional exchange platform for the deep integration of domestic and international semiconductor industry chains, supply chains, and value chains, earning the reputation of "China's No.1 Exhibition for Indigenous Semiconductor Brands."

    The second edition in 2025, themed "Chip-Enabled Future, Smart-Created Ecosystem," covers an exhibition area of over 60,000 square metres, bringing together more than 600 leading semiconductor industry chain enterprises from over 20 countries and regions worldwide, spanning core segments such as IC design, wafer manufacturing, and advanced packaging and testing. It is expected to attract over 60,000 professional visitors.

    The previous edition achieved outstanding results, "getting off to a flying start with results exceeding expectations," gathering 400 exhibitors, attracting 68,000 visitors, hosting 22 professional forums, and generating 1.06 million online interactions. It received high praise from People's Daily and Xinhua News Agency and was successfully selected as one of the "Top Ten Events in Shenzhen's Development and Reform in 2024," marking a key step towards establishing itself as "China's No.1 Exhibition for Indigenous Semiconductor Brands."

【Core Value for Exhibitors】

    The core value of the Shenzhen Bay Semiconductor Ecosystem Expo lies in its platform nature that precisely connects the semiconductor industry cluster in the Greater Bay Area. The specific value can be broken down as follows:

    - Leveraging Shenzhen's mature semiconductor industry foundation, where in 2024 the scale of Shenzhen's semiconductor and integrated circuit industry reached RMB 256.4 billion, growing 26.8% year-on-year, and maintaining a 16.9% growth rate in the first half of 2025, with over 700 industry chain enterprises. As a core link in the semiconductor industry ecosystem of the Greater Bay Area, the expo enables exhibitors to directly connect with Shenzhen Major Investment Group-affiliated companies, as well as 5,000 professional buyers from leading enterprises such as BYD, Foxconn, and DJI, sharing the largest incremental market opportunities in the semiconductor industry.

    - Building a one-stop business and trade platform covering the entire semiconductor industry chain, meeting the matchmaking needs of exhibitors across all segments.

    - Keeping pace with industry trends of "technological breakthroughs" and "ecosystem building," creating a technology exchange hub for deep integration of industry, academia, research, and application, driving core technology breakthroughs and collaborative industrial ecosystem development.

    - Serving as a strategic gateway for local enterprises to showcase indigenous innovation achievements, connect with international resources, and achieve brand globalisation, helping Chinese semiconductor companies expand into overseas markets. The expo also innovatively upgrades the "online + in-booth + offline" trinity, year-round, all-domain resource matchmaking mechanism, promoting the integration of all industry factors. The first RMB 5 billion local semiconductor industry investment fund was also unveiled during the expo, injecting financial vitality into the industry's development.

【Exhibition Zones】

    The second edition in 2025 features four core exhibition zones and three special exhibition zones, as detailed below:

    - Four core exhibition zones: Wafer Manufacturing Zone, Advanced Packaging Zone, Compound Semiconductor Zone, and Chip Design Zone

    - Three special exhibition zones: AI Chip and Edge Computing Ecosystem Zone, RISC-V Ecosystem Zone, and Chiplet and Advanced Packaging Ecosystem Zone

    The number of international exhibitors at this edition has increased by over 50% year-on-year, covering global TOP30 semiconductor enterprises such as Applied Materials, Lam Research, and KLA from the United States; Tokyo Electron, DISCO, and Nikon from Japan; Merck and ZEISS from Germany, as well as domestic leading enterprises including NAURA, Xinkaile, Piotech, China Resources Microelectronics, and SMEE.

【Concurrent Events】

    Over 30 professional industry events will be held concurrently with the expo, including top-tier industry conferences such as the 2025 Chip Conference and the 9th International Symposium on Advanced Lithography Technology, with multiple academicians and over a thousand industry leaders invited to engage in in-depth discussions on topics such as core technology breakthroughs and collaborative industrial ecosystem building.

    During the events, the 2025 "BayCore Award" will be announced, with over 100 companies expected to receive awards. The "Top Ten Advances in China's Chip Science 2024" will also be unveiled. Additionally, an international supply-demand matchmaking conference for Chinese manufacturing going global will be held to help domestic enterprises connect with overseas market resources.

【Notable Exhibitors】

    This edition brings together notable exhibitors from all segments of the industry chain, categorised as follows:

    - International leading equipment and materials brands: ASML, Applied Materials (AMAT), Lam Research, KLA, Tokyo Electron (TEL), DISCO, Nikon, Canon, HITACHI, DNS, Merck, ZEISS, Edwards, SEMILAB, 3M Korea, JUSUNG, Sumitomo Chemical, KE, FerroTec, Thermo Fisher, EBARA, Keysight, SHIBAURA

    - Leading Chinese equipment and materials brands: NAURA, Xinkaile, Piotech, ACM Research, SMEE, Hwatsing, Kingsemi, AMEC, Zhicheng Technology, Jiangfeng Electronics, Yak Technology, National Silicon Industry Group, Hwatsing Precision, Shuoke Zhongkexin, Han's Semiconductor, SICC, Quick Chip, Xianwei Technology, Sirui Intelligent, CETC Fenghua, Zhicheng Semiconductor, TankeBlue, SICC Materials, Shuoke Crystals, Tianyu Semiconductor, Coherent II-VI

    - Chip design and manufacturing brands: China Resources Microelectronics, Fountyl Technologies, Xinyue Semiconductor, Innoscience, HiSilicon, ZTE Microelectronics, Pengjin Hi-Tech, Shanghai Huali Microelectronics, Hua Hong Semiconductor, Yangtze Memory Technologies, ChangXin Memory Technologies

    - Packaging and testing brands: Hua Tian Technology, SJ Semiconductor, JCET, TFME

    - EDA and design services brands: Qingyunfang Technology, Empyrean Technology, Primarius Technologies, Semitronix

    - Cloud services and AI chip brands: Intel, Alibaba DAMO Academy, Tencent Cloud, Lenovo, China Telecom, China Mobile, China Unicom, Hygon Information Technology, Lanxin Computing

    - Testing and measurement instrument brands: Wanliyan Technology, Keysight

    - Compound semiconductor and power device brands: National Third-Generation Semiconductor Technology Innovation Centre (Shenzhen), Shenzhen Pinghu Laboratory, Jiufengshan Laboratory, Enkris Semiconductor, Gallium Future, Danxi Technology, Xinwei Semiconductor, Haimu Xinwei, TankeBlue, SICC Materials, Shuoke Crystals, Tianyu Semiconductor, Tongguang Semiconductor, Zhejiang Jingrui, Titan Future, Tiansheng Semiconductor, Xinjuneng, San'an Semiconductor, Anhai Semiconductor, Dkmicroelectronics, Hesheng New Materials, Jinghang Special Carbon, Hengpu Technology, Aoyida New Materials, Chuangrui Spectroscopy, Westlake Instruments, Keyou Semiconductor, Jiuyu Semiconductor, Guoyang Electronics, Zhanxin Electronics, Lingrui Semiconductor, CEC Compound Semiconductor, XinGan Technology, Yibian Electric, Dongni Electronics, Sigma, Mingyang Semiconductor, Ruifei Optoelectronics, Liguan Micro, Gree Electronics, Xinyan Ke

    - Materials and components brands: Hangzhou Zhongxin Wafer, Anhui Boxin Micro, Ningxia Dunyuan Juxin, Xinfeng Precision, Shenzhen Weihao Technology